A YouTube video posted today by Huawei titled Huawei Kirin 990 Warm-up reveals that the chip will be introduced at the upcoming IFA show in Berlin on September 6th. Designed by the company’s HiSilicon unit and manufactured by TSMC using the 7nm EUV process, the chip will be powering the Mate 30 line. And Yanmin Wang, a regional president with Huawei’s Consumer Business Group, told TechRadar that the chip will also be found in the foldable Huawei Mate X. Originally, the Kirin 980, used in the Mate 20 Pro and the P30 series, was supposed to be under the hood of the company’s first foldable phone.

What isn’t known at the moment is whether the integrated 5G modem on the Kirin 990 SoC will support both ultra-high-band mmWave 5G networks and sub-6GHz 5G networks. Most 5G networks in the country use the latter. Low-band spectrum travels farther and penetrates buildings better than higher-frequency airwaves. However, spectrum in the mmWave frequencies have a larger capacity and offer faster speeds.